Taiwan Semiconductor to phase out 6-inch wafer manufacturing over 2 years

[View of the Tainan Science Park in Taiwan, Asia.]
BING-JHEN HONG

Taiwan Semiconductor Manufacturing (NYSE:TSM [https://seekingalpha.com/symbol/TSM]) will phase out its 6-inch wafer production business over the next two years and continue consolidating its 8-inch wafer manufacturing capacity to improve operational effectiveness.

TSM told Seeking Alpha in an emailed statement that the decision was based on market dynamics and aligns with its long-term business strategy.

The company noted that it was working with customers to make sure of a smooth transition and remained committed to meeting their requirements during the period.

TSM added that the decision would not impact its previously announced financial targets.

The company has only one 6-inch wafer fab and four 8-inch wafer fabs in Taiwan for mature-node chip production. Meanwhile, its advanced-node production for customers like Apple (AAPL [https://seekingalpha.com/symbol/AAPL]) and Nvidia (NVDA [https://seekingalpha.com/symbol/NVDA]) is carried out in 12-inch fabs, Reuters reported [https://www.reuters.com/world/asia-pacific/tsmc-phase-out-6-inch-wafer-production-over-two-years-2025-08-12/].

_Update: The story was updated with a statement from TSM._

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